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Electronic Components
Photovoltaics Packaging
Semiconductors
packaging paste for semiconductor
Specialty Pastes

Die Attach Paste

HS-411 silver paste is designed for chip (such as LED/IC) packaging.

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Nano-Sintered Materials

HS-401 is a nano sintered silver paste. It can be used for high power modules (such as IGBT) packaging. It has high thermal conductivity, high electrical conductivity and high reliability.

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Address:No.13, Riyue North Second Road, Qidingshan Street, Jinzhou District, Dalian City, Liaoning Province, China

Email Address:hs-tech@huashengchn.com

Contact person:Mr Ji

Phone:+86-411-39554099

Links: 中国半导体协会中国电子元件行业协会佳利电子广东风华高新科技华信安电子科技三环集团江苏灿勤科技

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