This conductive paste is formulated by low melting point metal powder and high melting point metal powder with resin, subsequently curing the resin through heating. This process creates a supportive framework that enhances heat and chemical resistance. Additionally, by means of heating and semi-sintering, it conducts and forms an alloy (IMC layer), resulting in a product that is resistant to vibration and heat, ensuring high reliability. Its applications are already prevalent in the semiconductor and automotive sectors.
